ホーム > イベント・セミナー > 各種セミナー > Effective Mitigation of Shock Loads in Embedded Electronic Packaging using Bilayered Composites

Effective Mitigation of Shock Loads in Embedded Electronic Packaging using Bilayered Composites

日時:2013年11月26日(火)13:00から14:30
場所:工学研究科2号館 232講義室
講師:Prof. Shaker Meguid (Director of Mechanics and Aerospace Design Laboratory, University of Toronto)

概要:
Shock loads which are characterised by high intensity, short duration and vibration at varied frequencies can lead to the failure of embedded electronics typically used to operate/control numerous devices. Failure of electronics renders these devices ineffective, since they cannot carry out their intended function. It is therefore the objective of this work to determine the behaviour of a typical electronic board assembly subject to severe shock loads and the means to protect the electronics.
Specifically, three aspects of the work were considered using 3-D FE simulations in supercomputer environment. The first was concerned with the dynamic behaviour of selected electronic devices subject to shock loads. The second with the ability of different potting materials to attenuate the considered shock loads. The third was with the use of a new bilayer potting configurations to effectively attenuate the shock load and vibration of the electronic board. The shock loads were delivered to the JEDEC standard board using simulated drop impact test.
The effectiveness of different protective potting designs to attenuate the effect of shock loads was determined by considering the two key factors of electronics reliability: the stress in the interconnection and deformation of the printed circuit board. Our results reveal the remarkable effectiveness of the bilayer potting approach over the commonly adopted single potting attenuation strategy.

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